Job Details

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Qualcomm Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. This is the Invention Age - and this is where you come in.

General Summary:

Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and cross-functional teams. Team is looking for experienced packaging engineer who has developed with various packaging technologies Flipchip, CSP (Chip-Scale Package), PoP (Package-on-Package), SiP (System in Package), Module package. Some management and integration lead experience will be a plus.

• Responsible from exploring, development and HVM deployment of FCCSP, PoP and/or SiP/Module packaging technologies.
• Responsible for initiating & defining package process flow, material set/ BKM, test vehicle, DOEs & cornering, process control plans to successfully develop manufacturable and reliable products.
• Interface with OSATs, substrate/ material suppliers, tooling makers in developing technology related to product requirements. Align with internal product teams on Design Rule and its establishment.
• Associate with internal design team and drive DFM methodology for new technologies.
• Work with internal design, modeling and procurement teams to implement technically best and lowest cost packaging.
• Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management and share with cross team members.
• Good knowledge of SPC/QC concepts, failure analysis process techniques, manufacturing floor operations and quality issue handling.

Minimum Qualifications

• 10+ yrs of experience working in a fast-paced semiconductor packaging environment for consumer products.
• Manufacturing process experience in – FC-CSP and/or PoP and/or SiP/module, wafer bumping, wafer handling, flipchip, Underfill, Molding, SMT, Sputter shielding and other packaging technologies.

Preferred Qualifications

• Experience in working with outside suppliers/partners.
• Process integration experience in taking semiconductor packaging products from development to HVM.
• Experience with packaging assembly manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component, component & board level reliability testing.

Educational Requirements

• Required: Bachelor's, Electrical Engineering and/or Materials Science and/or Mechanical Engineering
• Preferred: Master's, Electrical Engineering and/or Materials Science and/or Mechanical Engineering

Applicants: Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. You may provide an accommodation request through Qualcomm Careers. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

Qualcomm expects its employees to abide by all applicable policies and procedures, including security and other requirements regarding protection of company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

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If you would like more information about this role, please contact Qualcomm Careers.