Job Details

Company: Qualcomm Technologies, Inc.

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

Overview

Join Qualcomm Technologies Inc.'s Global CAD team pushing the limits of Signoff solutions for the Snapdragon chips powering billions of mobile devices. The position requires Signoff Timing and spice simulation experience, with CAD development skills to define and develop tools and methodologies for accuracy, compute, in close collaboration with Snapdragon Physical Design and Timing teams. Qualcomm is using leading edge internal and external technologies in the Signoff domain, including pioneering in genAI/ML, and developing a hierarchical solution, as well as enabling the latest STA features to reduce conservatism in Signoff.

Responsibilities

• Improving the Timing and Cell Characterization methodology for diverse Mobile, Compute, AI, IoT Snapdragon chips.
• Participate in the enablement and validation of new cell characterization methodologies and features, through careful spice correlation and CAD development. Collaborate with AI team on compute and turn-around time reduction initiatives.
• Correlation of STA tools with spice, version-to-version validation.
• Provide solutions to the Snapdragon design teams, analyze their requests, and address their requests through ticket queues.
• Interfacing with EDA vendors to enable production-ready tool sets that satisfy project requirements.
• Setting up, augmenting, and maintaining a regression of complex STA designs.

Preferred Qualifications

• Bachelor's degree, Masters degree or PhD in Computer Engineering, Electrical Engineering, or related field. Maths minor is a plus.
• Deep knowledge of STA features and Timing concepts.
• 2-6 years of experience in Signoff Timing of SoCs at either top-level or block-level.
• 2-6 years of experience with scripting tools and programming languages: Python and TCL preferred.

Principal Duties and Responsibilities

• Participate in the STA and Cell Characterization flows and features enablement for foundry advanced process nodes, at block, subsystem, and top level.
• Participate in the enablement of new methodologies and features for turn-around time reduction on various subsystems such as Modem, GPU, CPU, DDR, Camera, Video, NSP.
• Interface and drive EDA vendor Application Engineers on the resolution of Signoff problems faced by the Snapdragon design teams.
• Participate in the specification of new Signoff CAD solutions addressing the PPA requirements of the design teams.
• Deep dive on STA and/or spice issues and establish as a go-to domain expert.
• Participate alongside Qualcomm's AI team in R&D initiatives driving differentiation in terms of compute and turn-around time.

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field.

Equal Employment Opportunity and Accommodation

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, Qualcomm is committed to providing an accessible process. You may email ...@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities.

Pay range and Other Compensation & Benefits

$98,500.00 - $147,700.00

The above pay scale reflects the broad minimum to maximum pay scale for this job code and location. Salary is one component of total compensation. Qualcomm offers a competitive annual discretionary bonus program and potential RSU grants, and a comprehensive benefits package. Your recruiter can discuss details about Qualcomm benefits.

If you would like more information about this role, please contact Qualcomm Careers.